Hybrid Shielding Technology

Posted: 01 May 2016 / in Board Level Shielding

3G has developed a very unique and high performance Board Level Shielding Technology. 3G Hybrid Shield provides the high isolation / shielding performance of machine housing at a fraction of the cost and weight. Hybrid Shield can be reflowed directly your PCB and due to the design features saves designers valuable board space while allowing easy access to the components on the board. Contact us today and learn how Hybrid Shield can work for you and lower your BOM cost.

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